Application: | Electronics, Industrial |
---|---|
Standard: | GB, ASTM |
Purity: | >99.95% |
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Material | WCu% Tungsten Content |
Hardness HB |
g/ Density at 20ºC |
W/M.K Thermal conductivity at 25ºC |
(10-6/k) Coefficient of thermal expansion at 20ºC |
W90Cu10 | 90 | 260 | 17.0 | 180-190 | 6.5 |
W85Cu15 | 85 | 240 | 16.4 | 190-200 | 7.0 |
W80Cu20 | 80 | 220 | 15.6 | 200-210 | 8.3 |
W75Cu25 | 75 | 195 | 14.9 | 220-230 | 9.0 |
W50Cu50 | 50 | 125 | 12.2 | 310-340 | 12.5 |
Thickness (mm) |
Width(mm) | Length(mm) | Surface | Rolled condition | |
Molybdenum Plate |
8.0-16.0 | 10-1000 | 10-1000 | Alkali washed |
Hot rolled |
3.0-8.0 | 10-1000 | 10-1000 | Hot rolled | ||
Molybdenum sheet |
1.5-3.0 | 10-1000 | 10-2500 | Acid cleaning |
Coled rolled |
0.5-1.5 | 10-1000 | 10-2500 | Cold rolled | ||
0.2-0.5 | 10-1000 | 10-2500 | Cold rolled |